Product Description

Adlink DLAP-8100 Series new AI IPC with 14th/13th/12th Intel Core Processor

Key Features

• Intel 14th/13th/12th-Gen Core 35W/ 65W LGA1700 CPU
• Up to 128GB DDR5 4800MHz (4x SODIMM slots)
• Supports NVIDIA RTX A6000E 350W GPU with full speed Gen4 x16 signal
• 2x DP++, 2x HDMI, 3x 2.5GbE, 4x COM, 8DI, 8DO, 4x USB3.2, 2x USB 3.1
• Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support
• Embedded expansion: 1x M.2 2230 Key E (PCIe Gen3 x1)

ADLINK's DLAP series provides robust, compact, industrial-grade fanless platforms, purpose-built for AI-based applications in challenging environments. These systems are equipped with powerful Intel processors and provide advanced AI capabilities, making them suitable for a wide range of applications in retail, parking, agriculture, and manufacturing. With an emphasis on SWaP (Size, Weight, and Power) optimization, these platforms are designed to excel in industrial and embedded settings, ensuring exceptional durability under extreme temperatures, shocks, and humidity.

The DLAP-8100 is a high-performance Edge AI platform, featuring 14th/13th/12th Gen Intel Core 35W/65W LGA1700 CPUs and supporting up to 128GB DDR5 4800MHz memory via four SODIMM slots. Designed for compute-intensive AI workloads, the system accommodates a full-speed NVIDIA RTX A6000E 350W GPU with a PCIe Gen4 x16 interface, enabling unparalleled AI inference and training capabilities at the edge.

For rich I/O, the DLAP-8100 includes 2x DP++, 2x HDMI, 3x 2.5GbE, 4x COM ports, 8DI, 8DO, 4x USB 3.2, and 2x USB 3.1. It also supports up to four hot-swappable 2.5" SATA 6 Gb/s drives with RAID 0/1/5/10 configurations, ensuring reliable and flexible data management for high-throughput applications.

Expansion is further enhanced with 1x M.2 2230 Key E (PCIe Gen3 x1) for wireless modules or additional edge connectivity. The DLAP-8100 is the ideal platform for demanding edge AI scenarios such as industrial automation, video analytics, and smart manufacturing, delivering robust compute power and rich connectivity in a compact, industrial-grade form factor.

Specifications

Datasheet