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Product Description
Unleash Unparalleled Server Performance with the ASRock Rack TURIN2D24TM3-2L+ Motherboard
Experience a new era of computing power and efficiency with the ASRock Rack TURIN2D24TM3-2L+ Motherboard. Designed for demanding server environments, this motherboard empowers your business-critical applications with cutting-edge technology and robust performance.
Exceptional Processing Power
Harness the raw power of AMD's latest EPYC processors. The TURIN2D24TM3-2L+ supports dual Socket SP5 (LGA 6096), accommodating the formidable AMD EPYC 9005*/9004 series, including those enhanced with AMD 3D V-Cache Technology, and the 97x4 series. This ensures unparalleled processing capabilities for even the most data-intensive tasks.
Proprietary T-Shape Design for Enhanced Flexibility
The motherboard's unique T-shape design (18.8607" x 17.0149") provides exceptional flexibility in system configuration. This innovative layout maximizes space utilization within your server rack, allowing for optimal component placement and improved airflow.
High TDP Support for Demanding Workloads
With a Thermal Design Power (TDP) support of up to 500W, the TURIN2D24TM3-2L+ is engineered to handle the most demanding server workloads. This ensures stable and reliable performance, even under heavy utilization.
Key Features:
- Dual Socket SP5 (LGA 6096) supporting AMD EPYC 9005*/9004 (with AMD 3D V-Cache Technology) and 97x4 series processors
- Proprietary T-shape design (18.8607" x17.0149")
- TDP support up to 500W
Specifications
| Physical Status | |
| Form Factor | Proprietary T-shape |
| Dimensions | 18.8607" x17.0149" |
| Processor System | |
| CPU | Supports AMD EPYC™ 9005*/9004 (with AMD 3D V-Cache™ Technology) and 97x4 series processors *A BIOS update is required to support AMD EPYC™ 9005 series processors |
| Socket | Dual Socket SP5 (LGA 6096) |
| Thermal Design Power | Up to 500W |
| Chipset | System on Chip |
| System Memory | |
| Supported DIMM Quantity | 12+12 DIMM slots (1DPC) |
| Supported Type | Supports DDR5 288-pin RDIMM, RDIMM-3DS |
| Max. Capacity per DIMM | RDIMM: 96GB (2R) RDIMM-3DS: 512GB (2S8Rx4) |
| Max. DIMM Frequency | 6000 MHz |
| Voltage | 1.1V |
| PCIe Expansion Slots (SLOT7 close to CPU) | |
| PCIe x 32 | SLOT2: Gen-Z HP+8C (2 PCIe5.0 x16 / 2 CXL2.0* x16) [CPU0] SLOT3: Gen-Z HP+8C (2 PCIe5.0 x16 / 2 CXL2.0* x16) [CPU1] *Supports CXL1.1 while installing AMD EPYC 9004 (with AMD 3D V-Cache™ Technology) and 97x4 series processors |
| PCIe x 16 | SLOT1: Gen-Z 4C+ (PCIe5.0 / CXL2.0* x16) [CPU0] |
| Other PCIe Expansion Connectors | |
| M.2 slot | 1 M-key (PCIe3.0 x4), supports 2280/2260/2242/2230 form factor [CPU0] 1 M-key (PCIe3.0 x4), supports 2280/2242 form factor [CPU1] |
| Others | 2 MCIO (PCIe5.0 x8 or 8 SATA** 6Gb/s) [CPU0] 2 MCIO (PCIe5.0 x8 or 8 SATA 6Gb/s) [CPU0] 4 MCIO (PCIe5.0 x8) [CPU1] **MCIO1 and MCIO2 support PCIe only while installing 2 processors |
| SATA/SAS Storage | |
| PCH Built-in Storage | AMD EPYC™ 9005/9004 (Up to 32 SATA 6Gb/s): 4 MCIO |
| Ethernet | |
| Additional GbE Controller | Intel® i350: 2 RJ45 (1GbE) |
| OCP slot | 1 OCP NIC 3.0 (PCIe5.0 x16) [CPU1] |
| Server Management | |
| BMC Controller | ASPEED AST2600 |
| IPMI Dedicated GLAN | 1 Realtek RTL8211F for dedicated management GLAN |
| Graphics | |
| Controller | ASPEED AST2600 |
| VRAM | DDR4 512MB |
| Rear I/O | |
| UID Button/LED | 1 UID button w/ LED |
| VGA Port | 1 DB15 (VGA) |
| Serial Port | 1 RJ45 (COM) |
| USB 3.2 Gen1 Port | 2 Type-A (USB3.2 Gen1) |
| RJ45 | 2 RJ45 (1GbE) 1 dedicated IPMI |
| Internal Connector/Headers | |
| Power Connector | 2 (CRPS IN +12V/+12VSB, max. 2700W) |
| Other Power Connectors | 3 (2x4 pin, 12V) for GPU cards, 1 (2x3 pin, +12V_AUX, 3V, 3VSB) for OCP, 1 Micro-fit (2x3 pin, 12V, 3V, 3.3VSB) for Riser or Internal SSD, 1 Micro-fit (2x8 pin, 12V, 5V) for HSBP, 1 (2x6-pin, 12V) for HSBP |
| Auxiliary Panel Header | 1 (26-pin): system fault LED, locate, SMBus, 1 (18-pin): system fault LED, LAN1/LAN2 activity LED, locate, SMBus |
| VGA header | 1 |
| Fan Header | 6 (2x3-pin) for 2U system, 8 (2x4pin) for 1U system |
| TPM Header | 1 (13-pin,SPI) |
| SGPIO Header | 4 |
| HSBP | 1 |
| SMBus header | 3 |
| PMBus header | 1 |
| IPMB Header | 1 |
| Clear CMOS | 1 (contact pads) |
| Others | 1 Chassis Intrusion Header (2-pin) |
| USB 3.2 (Gen1) Header | 1 (26-pin, 1 USB3.2 Gen1), 1 (19-pin, 1 USB3.2 Gen1) |
| NMI Header | 1 |
| LED Indicators | |
| Standby PWR LED | 1 (3.3VSB) |
| 80 Debug Port LED | 1 |
| Fan Fail LED | 8 |
| BMC heartbeat LED | 1 |
| System BIOS | |
| BIOS Type | AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM |
| BIOS Features | ASRock Rack Instant Flash, ACPI 6.4 and abouve compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP) |
| Hardware Monitor | |
| Temperature | CPU, MB, Card side Temperature Sensing |
| Fan | Fan Tachometer CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjust by CPU Temperature) Fan Multi-Speed Control |
| Voltage | P0_VDDCR_CPU0, P0_VDDCR_CPU1, P0_VDDCR_SOC, P0_VDD_18_DUAL, P0_VDD_11_S3, P0_VDDIO, P1_VDDCR_CPU0, P1_VDDCR_CPU1, P1_VDDCR_SOC, P1_VDD_18_DUAL, P1_VDD_11_S3, P1_VDDIO, +BAT, +12V, +3VSB, +5VSB |
| Environment | |
| Temperature | Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C |
| Humidity | Non operation humidity: 20% ~ 90% ( Non condensing) |
