Product Description
Digi XBee 3 North America LTE Cat 1, 3G, GNSS, Verizon SIM
- Hardware
- Cellular Chipset: Thales PLS63-X
- Form factor (connector footprint): Digi XBee® 20-pin through-hole
- Antenna options: 2 U.FL: cellular diversity, 1 U.FL: GNSS; embedded Bluetooth® antenna
- Dimensions: 30.48 mm x 43.18 mm (1.2 in x 1.7 in)
- Operating temperature: −40 ºC to 80 ºC (−40 ºF to 176 ºF)
- SIM size: 4FF Nano
- Interface and I/O
- Data interface: UART, SPI, USB
- Operating modes: Transparent and API over serial, PPP over USB
- Security: Digi TrustFence® security with secure boot and protected JTAG
- Configuration tools: Digi XBee Studio® (local), Digi Remote Manager® (OTA)
- Embedded programmability: MicroPython with 8 MB flash / 64 kB RAM
- I/O: 4 ADC lines (10-bit), 13 digital I/O, I2C
- Bluetooth: Bluetooth Low Energy (BLE)
- Cellular characteristics
- Transmit power (4G LTE/3G/2G): 23 dBm / 23.5 dBm / NA
- Receive sensitivity (4G LTE/3G/2G): 103 dBm / 110 dBm / NA
- Supported bands: B2, B4, B5, B12, B13, B25, B26, B66, B71
- Downlink / uplink speeds: 10 Mbps downlink, 5 Mbps uplink (USB); 921 kbps downlink and uplink (UART)
- Duplex mode: Full-duplex
- Power requirements (at 3.3 VDC input power)
- Supply voltage: 2.8 to 5.5 V
- Peak transmit current: 1050 mA with Bluetooth disabled; 1090 mA with Bluetooth enabled
- Avg transmit current: 890 mA
- Avg receive current: 320 mA
- Regulatory and carrier approvals
- FCC (USA): MCQ-XB3C2 and QIPPLS63-X
- ISED (Canada): 1846A-XB3C2 and 7830A-PLS63X
- PTCRB, AT&T and Verizon: Complete
- Warranty
- 1-year
Other Details
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