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  • TO23-H60
  • TO23-H60
  • TO23-H60
  • TO23-H60
  • TO23-H60
  • TO23-H60

    • Gigabyte ORv3 Compute Node - 3rd Gen Intel Xeon Scalable - 2OU 3-Node DP 4-Bay Gen4 NVMe/SATA/SAS - TO23-H60

    GIGABYTE

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    SKU:
    HS-GIG-TO23-H60
    Condition:
    New
    Availability:
    Vendor Direct Ship | ETA - Request A Quote | Email: sales@hssl.us | Call Us: +1 888 988 5472 |
    MPN:
    TO23-H60
    Dimensions (WxHxD, mm):
    2OU 3-Node 180 x 90 x 740
    Motherboard:
    MH62-HD2
    CPU:
    3rd Generation Intel Xeon Scalable Processors, Dual processor, 10nm technology, CPU TDP up to 270W
    LAN:
    Front: 1 x 10/100/1000 Mbps Management LAN
    Open Rack Version:
    ORv3
    Memory:
    16 x DIMM slots, DDR4 memory supported only, 8-channel memory architecture, RDIMM modules up to 128GB supported, LRDIMM modules up to 128GB supported, 3DS RDIMM/LRDIMM modules up to 256GB supported, 1.2V modules: 3200/2933/2666 MHz
    Storage:
    Front side: 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
    Packaging Content:
    1 x TO23-H60, 2 x CPU heatsinks
    Note:
    Images may not be exact, please check specifications.
    Required A Volume Purchase:
    Contact us for a volume pricing | volumeorders@hssl.us

    Product Description

    Gigabyte ORv3 Compute Node - 3rd Gen Intel Xeon Scalable - 2OU 3-Node DP 4-Bay Gen4 NVMe/SATA/SAS - TO23-H60

    • 3rd Gen Intel Xeon Scalable Processors
    • Dual processor, LGA 4189
    • 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
    • 1 x Dedicated management port
    • 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
    • 2 x LP PCIe Gen4 x16 slots
    • 1 x OCP 3.0 Gen4 x16 slot
    • 48V DC Bus Bar power solution

    Other Details

    (Manufacturer Standard Warranty) - Not Clear what product you need, or can't find your specific product/service part number? Call us +1 888 988 5472 | Fax: +1 888 920 3445.

    Product Videos

    Custom Field

    MPN TO23-H60
    Dimensions (WxHxD, mm) 2OU 3-Node 180 x 90 x 740
    Motherboard MH62-HD2
    CPU 3rd Generation Intel Xeon Scalable Processors, Dual processor, 10nm technology, CPU TDP up to 270W
    LAN Front: 1 x 10/100/1000 Mbps Management LAN
    Open Rack Version ORv3
    Memory 16 x DIMM slots, DDR4 memory supported only, 8-channel memory architecture, RDIMM modules up to 128GB supported, LRDIMM modules up to 128GB supported, 3DS RDIMM/LRDIMM modules up to 256GB supported, 1.2V modules: 3200/2933/2666 MHz
    Storage Front side: 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
    Packaging Content 1 x TO23-H60, 2 x CPU heatsinks
    Note Images may not be exact, please check specifications.
    Required A Volume Purchase Contact us for a volume pricing | volumeorders@hssl.us

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