US Dollars
United Arab Emirates Dirham
Euro
British Pound
Turkish Lira
Canadian Dollar
South African Rand
Indian Rupee
Brazilian Real
Indonesian Rupiah
Singapore Dollar
South Korean Won
Japanese Yen
Chinese Yuan
Mexican Peso
Qatari Rial
Saudi Riyal
Product Description
IEI 3.5” SBC Supports Intel Tiger Lake-UP3 Core I Celeron Proccessor, with HDMI, DP, iDPM, Triple 2.5 GbE Lan Port, USB 3.2, M.2, SATA 6Gb/s, COM, Audio and RoHS, -10°C ~60°C - WAFER-TGL-U
IEI WAFER-TGL takes all the essential elements of the latest 11th Gen. Intel Core U-series processors and combines them with smart manufacturing features and proven durability in the compact size 3.5" form factor.
It is ideal for space-constraints installation, notably AGVs(Automated Guided Vehicle), AMR (Autonomous Mobile Robot) and small cabinets in factories. It features complete I/O interfaces such as three 2.5 GbE LAN ports for motion control / IP cameras, an M.2 B-key with SIM slot for LTE cellular communication, and USB 3.2 Gen 2, serial ports for connecting sensors and communicating with other devices.
11th Gen. Intel Core U-series
IEI WAFER-TGL is a 3.5" embedded board equipped with the 11th generation Intel Core U processor supporting up to 4 cores, 8 threads, turbo up-to 4.40 GHz. The Intel Core i7 and i5 processors are integrated with Intel Iris Xe 96EU graphics core, delivering high AI inference performance for the SoC. With no graphics card required, it can provide a cost-effective industrial solution featuring low power consumption and effective heat transfer.
Effortless Upgrade
Compared with the previous generation, the WAFER-TGL features high performance CPU and GPU, along with AI deep learning capabilities in a compact 3.5" form factor. The WAFER-TGL provides effortless upgrade, allowing new version replacement to improve performance without changing the original mechanical design.
Quad Independent Displays with up to 4K Resolution
The WAFER-TGL 3.5" motherboard integrates the latest Intel® Iris® Xe graphics (Gen12), offering max. 96 EUs and up to 2.95 times faster graphics performance to deliver excellent graphics performance. With two HDMI 1.4 (up to 4096 x 2160@30Hz), one DP 1.4 (up to 4096 x 2160 @60Hz) and the option to use the iDPM interface to support four independent displays, it is ideal for video surveillance, kiosks, digital signage, or medical imaging application which requires high graphics performance.
Free to choose display connections with iDPM modules
More display I/Os are supported via IEI iDPM connector. The iDPM display converter boards allow the WAFER-TGL to meet customers’ diverse display interface requirements such as the legacy display port, VGA and LVDS, or eDP for TFT LCD connection.
Ready for Any Scenario
The WAFER-TGL supports up to quad independent display, thus it is flexible to use in multi-display applications. Its diverse display outputs offered by the iDPM modules make the WAFER-TGL more suitable for any feasible scenario.
Well-design Thermal Solution
IEI has developed a highly efficient thermal solution for the 3.5" motherboard - IEI Heat Conduction Casing (IHCC). The IHCC can effectively improve heat transfer performance, and we will keep on improving our heat sink design to ensure providing an innovative thermal solution for the industrial market.
The IHCC consists of a case and a heat conduction block that is made to perfectly fit with the CPU to achieve heat transfer.
Diverse mounting options
With its well-design thurmal casing,the WAFER-TGL provides 13 holes on three sides. It can be installed on a control cabinet's rear panel, door, or onto a DIN rail. And it is easy to install additional thermal module for operating under high ambient temperatures.
Features
-
3.5＂ SBC with Intel Tiger Lake-UP3 on board SOC processor, support SO-DIMM DDR4-3200 memory
-
Support Quadruple independent display: 2 x HDMI 1.4, 1 x DP 1.4, 1 x iDPM
-
High-speed I/O interface: 4 x USB 3.2 gen 2 (10Gb/s), SATA (6Gb/s)
-
Support three Intel I225V/I226V 2.5GbE network port
-
Support M.2 A Key, B key extension
DATASHEET
