IEI Fanless DIN-Rail Embedded System Tiger Lake 11th Gen Intel Celeron Solution (up to 4 Cores) - DRPC-W-TGL

Designed with 11th Generation Intel Core/Celeron processor and Intel UHD graphics, the DRPC-W-TGL fanless embedded system offers both excellent performance and energy efficiency. With up to 4 cores and 4.40 GHz max turbo frequency, the Intel Core processor acts as the heart of the DRPC-W-TGL fanless embedded system and offers 2 times performance improvement over the predecessor Whiskey Lake.

Optimized Size Saves Cabinet Space

Based on IEI’s industrial-grade 3.5” embedded systems, the DRPC -W series are compact without sacrificing the flexibility in I/O expansion that is often required for IoT scalable sensor connectivity. Moreover, the front-side I/O design is easy for in-cabinet installation.

Time-to-Market Customization

The DRPC-W series’ enclosure is designed for 3.5" single board computers. With customizable I/O plates, the DRPC-W series allows customization to satisfy various requirements by using IEI's extensive 3.5" SBCs, WAFER series, offering diverse platform options from low-power to extreme performance. This helps assure an efficient and quick integration for customers' applications.
*Customized by project base

Easy Assembling & Maintenance

With an easy-to-open bottom cover, the DRPC-W series can delive r advantages of quick maintenance and Configure-to-Order Service (CTOS) for customers to reduce potential time to market and cost consumption.

• Fast assembly for all accessories
• Simple steps to open enclosure for maintenance, such as M.2, HDD, memory modules
• Accelerate system integrator's local configure-to-order assembly service for end customers

Scalable Wireless Communication Enables Remote Deployments

The DRPC-W-TGL is built with multiple wireless connectivity options necessary for remote and mobile deployments, which include Bluetooth, WiFi and 4G/LTE that enable connections with a variety of industrial IoT devices.
*Wireless M.2 modules are optional

Fanless System with Efficient Thermal Design

The DRPC-W-TGL thermal design is optimized for better heat conduction using a pin-fin heatsink concept. This enhances two-dimensional heat conduction and reduces flow impedance for better heat dissipation in this fan-less system. The overall weight is also reduced by 35%. Moreover, the reduced weight enhances system reliability in vibration-sensitive applications, such as AGV, making the DRPC-W-TGL has vastly superior performance to the traditional plate fin heat sink with continuous parallel fins.

Advanced High-efficiency Fan Kit Releases Extreme Computing Power