IEI High Performance Thermal Solutions - CF-1156D

Product Description

IEI High Performance Thermal Solutions - CF-1156D

Demanding applications require robust cooling solutions. The IEI CF-1156D high-performance heatsink is engineered to meet the thermal challenges of today's powerful processors, ensuring optimal performance and longevity for your valuable equipment.

Benefits of Choosing IEI CF-1156D:

• Enhanced System Stability: By effectively dissipating heat away from the CPU, the CF-1156D prevents overheating and maintains system stability even under heavy workloads.
• Extended Component Lifespan: Lower operating temperatures translate to reduced stress on components, ultimately extending their lifespan and minimizing the risk of premature failure.
• Quieter Operation: Efficient heat dissipation allows for quieter fan operation, creating a more pleasant working environment.
• Increased Reliability: The robust construction and high-quality materials of the CF-1156D ensure long-term reliability and consistent performance.

Features:

• Compatible with Intel LGA 1156/1155 socket CPUs
• High-density aluminum fin design for maximum heat dissipation
• Copper base plate for optimal heat transfer from the CPU
• Pre-applied thermal paste for easy installation
• Low-profile design for compatibility with a wide range of systems

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