AAEON’s UP brand has expanded its line of compact developer boards with the launch of two credit card-sized models—the UP TWL and UP TWLS. Built around Intel’s new Core 3 processor platform (formerly Twin Lake), both boards deliver powerful, energy-efficient computing in a rugged, ultra-small footprint designed for a wide range of edge and embedded applications.

---

Built for Flexibility and Performance

Both boards offer a choice of the latest Intel Core 3 Processor N355, Intel Processor N250, or Intel Processor N150, engineered for low power consumption without compromising on performance.

Measuring only 85 mm x 56 mm, these boards are optimized for space-constrained projects and are capable of operating in extended temperature environments from -20°C to 70°C, making them ideal for industrial, IoT, robotics, and AI edge deployments.

---

UP TWL: Classic I/O with GPIO Compatibility

The UP TWL is designed with familiar UP-series features, making it a natural fit for developers who value expandability:

• Raspberry Pi-compatible 40-pin GPIO

• 3x USB 3.2 Gen 2 ports

• 1x HDMI port

• 1x RJ-45 LAN port

This board is a continuation of AAEON’s commitment to developer accessibility, blending modern processing with flexible I/O options in a recognizable layout.

---

UP TWLS: Slimmer, More Specialized I/O

For users needing a sleeker, lower-profile board, the UP TWLS reduces height to just 25.13 mm by placing both the I/O and CPU on the same side. While it trades the 40-pin GPIO for more modular headers, it offers:

• 8-pin I2C wafer

• 10-pin SPI wafer

• 8-bit GPIO via 10-pin wafer

• 10-pin RS-232/422/485 serial communication

• M.2 E-Key slot for Wi-Fi module support

The UP TWLS is ideal for embedded deployments that require advanced peripheral interfacing and compact design.

---

Operating System Support & Security

Both boards support popular operating systems including:

• Ubuntu 22.04 LTS

• Yocto

• Windows

Security is also a priority, with TPM 2.0 included onboard to meet modern standards for trusted computing.

---

Final Thoughts

Whether you’re building a smart automation system, deploying edge AI applications, or creating robust IoT prototypes, the new UP TWL and UP TWLS boards from AAEON bring a powerful combination of compact design, extended temperature tolerance, and Intel-powered performance. With flexible I/O options and modern OS support, these boards offer developers a versatile platform for tackling tomorrow’s challenges in a small but capable package.