Product Description
IN500 solution
HuaWei IN500 Intelligent Ethernet Card
Product EOM Time: 2023-06-30
Product EOS Time:2028-06-30
 
Performance Boost
Focus on high-performance network acceleration in OVS and cloud storage scenarios. In OVS scenarios they help reduce CPU computing resources by 15% and support forwarding of over 10 Mpps improving performance while reducing CAPEX. In cloud storage scenarios they deliver outstanding IOPS and I/O latency that lead industry standards by over 30%.
Chip Innovation
Acceleration for multiple protocols: RoCE/iWARP/OVS/TCP&nbsp C language programming: industry's first of its kind to support forwarding of over 10 Mpps (48 Gbps/12 Mpps)&nbsp Multi-protocol acceleration Ethernet and FC converged
Reliability and Maintainability
Support the half-height half-length card form factor facilitating server deployment and O&ampM. With 15 W low-power design the NICs can be quickly deployed to accelerate networks without affecting the deployment of existing servers. They not only shorten the TTM of customers' networks but also support hitless upgrades.
Model | IN200 Ethernet NIC |
Form Factor | Low profile standard card |
PCIe Expansion | PCIe x16 compatible with x8/x4/x2/x1 PCIe 3.0 compatible with 2.0/1.0 |
NIC Chip | Huawei HiSilicon Hi1822 NIC chip |
NIC Ports | 4 SFP28 25GE service ports |
Optical Modules | SFP28 and SFP+ optical modules multi-mode or single-mode |
PXE  | UEFI (default) |
Features | &bull IEEE 802.3x flow control &bull PFC and ETS &bull VLAN offload and MAC filtering &bull Stateless offload (Checksum/TSO/LRO/RSS) &bull vRoCE and RoCE v2 &bull DPDK driver &bull SR-IOV |
Supported Servers | &bull FusionServer Pro 1288H V5 &bull FusionServer Pro 2288H V5 &bull FusionServer Pro 2488H V5 &bull FusionServer Pro 2488 V5 &bull FusionServer Pro 5288 V5 |
Operating Systems | &bull CentOS 6.8/6.9/6.10/7.0/7.1/7.2/7.3/7.4/7.5/7.6 &bull Red Hat Enterprise Linux (RHEL) 6.9/6.10/7.0/7.1/7.2/7.3/7.4/7.5/7.6 &bull SUSE Linux Enterprise Server (SLES) 11.2/11.3/11.4/12/12.1/12.3/15 &bull Ubuntu 14.04/16.04 /18.04 &bull VMware ESXi 6.0/6.5/6.7 &bull Microsoft Windows Server 2012R2/2016 &bull For more information about compatibility visit http://support.huawei.com/onlinetoolsweb/ftca/en. |
Dimensions (H × W × D) | 68.9 mm × 18.71 mm × 167.65 mm (2.71 in. × 0.74 in. × 6.60 in.) |
Weight | 0.5 kg (including the package) |
Operating Temperature | 5ºC to 45ºC (41ºF to 113ºF) |
Storage Temperature | &ndash40°C to +65°C (&ndash40°F to +149°F) |
Temperature Change Rate | 20°C/h (68°F/h) |
Humidity | 8% to 90% RH (non-condensing) |
Relative Storage Humidity | 5% to 95% RH (non-condensing) |
Humidity Change Rate | &le 20% RH/h |
Altitude | &le 3000 m (9842.52 ft.) When the intelligent NIC is used at an altitude of higher than 900 m (2952.76 ft) the highest operating temperature decreases by 1ºC (1.8°F) as the altitude increases by every 300 m (984.25 ft). |
 
Model | IN300 FC HBA Card |
Form Factor | Low profile standard card |
PCIe Expansion | PCIe x8 compatible with x4/x2/x1 PCIe 3.0 compatible with 2.0/1.0 |
HBA Chip | Huawei HiSilicon high-performance Fibre Channel HBA chip |
FC Ports | Single-port/Dual-port 8G/16G |
FC Specifications/Protocols | &bullSCSI-3 Fibre Channel Protocol (SCSI-FCP) &bullSCSI Fibre Channel Protocol-2 (FCP-2) &bullSecond Generation Fibre Channel Generic Services (FC-GS-2) &bullThird Generation Fibre Channel Generic Services (FC-GS-3) &bullFibre Channel Physical Interface 5 (FC-PI-5) &bullFibre Channel Physical Interface 6 (FC-PI-6) &bullFibre Channel Framing and Signaling (FC-FS-3) &bullFibre Channel Link Services 3 (FC-LS-3) |
Performance | 1.7M IOPS 6400 Mbit/s full-duplex |
Reliability Functions | &bullFEC (Forward error correction) &bullBB_CR (Buffer-to-Buffer Credit Recovery) &bullT10-PI (T10 Protection Information) |
Supported Servers | &bullFusionServer Pro 1288H V5 &bullFusionServer Pro 2288H V5 &bullFusionServer Pro 2488H V5 &bullFusionServer Pro 2488 V5 &bullFusionServer Pro 5288 V5 |
Operating Systems | &bullLinux OS: &bullSUSE Linux Enterprise Server (SLES) 11.4/12.2/12.3/15 &bullRed Hat Enterprise Linux (RHEL) &bull6.9/6.10/7.1/7.2/7.3/7.4/7.5/7.6 &bullCentOS 6.9/6.10/7.2/7.3/7.4/7.5 &bullUbuntu 18.04 LTS &bullOracle Linux 6.9/7.3 &bullFusionSphere 6.1u3/6.3 &bullVMware OS: &bullVMware ESXi 6.0.3/6.5/6.5.1/6.5.2/6.7 &bullWindows OS: &bullMicrosoft Windows Server 2012 R2/2016 &bullFor more information about compatibility visit http://support.huawei.com/onlinetoolsweb/ftca/en. |
Supported Optical Modules | Supports the delivered 8/16 Gbit/s optical modules |
Dimensions (H × W × D) | 68.9 mm × 18.71 mm × 167.65 mm (2.71 in. × 0.74 in. × 6.60 in.) |
Weight | 0.5 kg (including the package) |
Operating Temperature | 5°C to 45°C (41°F to 113°F) |
Storage Temperature | &ndash40°C to +65°C (&ndash40°F to +149°F) |
Temperature Change Rate | 20°C/h (68°F/h) |
Humidity | 8% to 90% RH (non-condensing) |
Relative Storage Humidity | 5% to 95% RH (non-condensing) |
Humidity Change Rate | &le20% RH/h |
Altitude | &le 3000 m (9842.52 ft.) When the intelligent NIC is used at an altitude of higher than 900 m (2952.76 ft) the highest operating temperature decreases by 1ºC (1.8°F) as the altitude increases by every 300 m (984.25 ft). |